Expert electronic supplies information details? The integration density of the current CPU is very high. The above functions are now integrated into the CPU and become a chip. For example, the K60 chip I am using now has these peripheral functions. The four chips of the early CPU peripherals are now integrated into one chip, so the current System is in one chip. That is, System on Chip (SoC), so theoretically there is a difference between CPU and SoC. The standard CPU refers to the early chips that only contain arithmetic units and controllers, and SoC has integrated the system into a whole chip. Therefore, the chips you buy now are all SoCs, and the standard CPUs are not too big to buy. Today’s CPUs have integrated many peripherals inside. See extra details on evq-p7l01p.

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In the past Wi-Fi technology, intercell co-channel interference (Co-Channel Interference,CCI) is another important factor affecting channel capacity. The core of CSMA/CA is to listen before you speak (listen before talk,LBT). The device monitors the wireless channel first and sends data without being occupied. In the case of multi-AP mesh networking (AP,Access Point, wireless access point), the equipment in the cell will listen to the interference signal of the cell adjacent to the same channel, causing the device to mistakenly think that the wireless channel of the cell is being occupied at this time, so stop transmitting. This kind of interference will significantly reduce the network capacity when the network is not optimized or the number of available channels is very small. As shown in the figure below, the four Wi-Fi AP are networked with three channels. However, since there are only three channels available, AP1 and AP2 have to be deployed on the same channel Channel 6, when the signal of AP2 is interference to the user equipment belonging to AP1-Overlapped Basic Service Set (OBSS, overlapping basic service units, which can be understood as overlapping cells with the same frequency).

Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors. Discover even more info at electronic supply.